The Dicing Before Grinding (DBG) in-line system is mainly being used for silicon processing, however, with the recent demand of glass-based electronic components, Disco has developed DBG solutions for glass.
The photographs below shows a 6" square (original thickness: 2 mm) soda glass processed with DBG into 10 mm square, 0.2 mm thick die. Compared to the conventional grinding then dicing method, DBG reduces the possibility of cracking and breakage due to operator or machine handling because die singulation occurs during the grinding process.
These benefits make DBG In-line System an excellent choice for processing glass, lithium tantalite and other hard, brittle materials.
Photo 1: Soda glass processed with DBG |
| |
Front side | Back side |
