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DISCO HOME > Solutions > Applications Example > DBG | |
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Applications Example |
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Die chipping countermeasure for the DBG process | |
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| The DBG process reverses the usual wafer singulation process. The DBG process first half-cuts the wafer on the front side and then grinds the backside of the wafer. As a result, it is possible to minimize backside chipping. However, if an inappropriate grinding wheel, processing conditions or protection tape is selected, chipping can occur due to the process load during backside grinding. The smaller the die size becomes, the greater the likelihood of this occurring. |
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It is possible to reduce the occurrence of die chipping by selecting the optimum wheel, processing conditions and backside protection tape (Photos 1, 2).
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