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DISCO HOME > Solutions > Applications Example > Grinding | |
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Applications Example |
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Ultra-Thin Wafers | |
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| By combining the three elements of machine, grinding wheel, and application in perfect harmony, it is possible to create wafers that are incredibly thin and light.
Such a combination made possible the silicon wafer shown in Photo 1. An amazing 5 micrometers (0.005 mm) thick, this wafer looks like a thin, transparent membrane when lit from beneath. Photo 1: This silicon wafer is just 5 micrometers thick. |
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