The Dicing Before Grinding process eliminates side cracks, which pose significant harm to yield in the conventional dicing after grinding process. DBG is therefore excellent not only for producing extremely thin die, but also for improving overall yield and process quality.
Side Cracks
Elongated die (especially those with shorter sides of 2 mm or less) and small die (1 mm x 1 mm or less) can, during the dicing process, manifest cracks that originate in the die backside and extend along the sides of the die.
Problems Caused by Side Cracks
• Reduction in die strength, which can cause breakage in back-end processes
• Shedding of fragments during pickup, which can damage other die
• Destruction or compromising of devices, etc.
Advantages of the DBG Process
The DBG process completely eliminates side cracks. The process is also ideal for today’s processing conditions, in which larger wafers, higher levels of integration, higher device performance, and thinner, smaller, and more elongated die (e.g., drivers) are increasingly common.
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Die side views
after conventional processing | Die side views
after processing with DBG |
* Both wafers 0.4 mm thick
