Applications Example - DISCO CORPORATION
disco
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About Disco Investors CSR
HOMENews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > DBG

Solutions


Applications Example

Die Strength of the DBG Chip
In recent years, wafers have become thinner and larger in diameter. As a result, there is concern of lower die strength and wafer warpage. To resolve these problems, the DBG process was developed. Below is an explanation regarding the die strength of DBG processed die.

<Process Example>
The decrease in backside chipping and side surface cracking are cited as merits of the DBG processing. As a result, damage to the die is decreased and die strength improves. As can be seen in the following graph, die made with the DBG process have higher die strength than those made with a normal process (backside grinding then dicing).


Also, by combining stress relief with the DBG process, further die strength
improvement is possible.
For details, please contact a Disco sales representative.




Personal Information Protection Policy
User Aqreement
Contact
Copyright 2001-2010 DISCO CORPORATION All rights reserved.
Back To Top