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DISCO HOME > Solutions > Applications Example > Dicing | |
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Applications Example |
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Profile Processing | |
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| Although typically used to dice wafers into die, the dicing saw can use the blade shape to perform a technique called "profile processing."
In the photograph below, a dicer has created fine ridges just 1 µm and 30 µm wide and grooves 50 µm deep. This processing technique can be used to form extremely precise components and sample components for sensors. |
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