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DISCO HOME > Solutions > Applications Example > Grinding | |
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Applications Example |
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Chip Warpage Thin Grinding | |
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| Chip warpage occurs due the stress imbalance of the pattern side (front side) and grinding side (backside). When the wafer becomes thin, chip warpage starts to become distinguished. With the recent progress of wafer thinning, chip warpage reduction is an important application. |
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| Fig.1 shows the chip warpage amount for an eight-inch wafer ground to 0.05 mm using typical grinding conditions (chip size: 8x10 mm). It was recognized that wafers that were processed with a Dry Polisher (DP) or Plasma Etcher (PE) achieved significant reduction in chip warpage. Fig.1 Chip warpage amount * The graph is displayed with a logarithmic scale
Measuring machine: Reflective laser measuring machine (Chapman) |
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