<Process Example>
Small die processing (0.4 x 0.4 x 0.06t mm) using the DBG process has been presented previously. This example describes how even smaller die sizes have been realized with the DBG process.
The photograph shown in Photo 1 is a 0.025 mmt silicon wafer that has been singulated into 0.075 x 0.075 mm die using the DBG process. An 8-inch wafer can produce approximately 3,140,000 die. By selecting the optimum processing method and conditions, it is possible to singulate micro-chips as shown below.
Photo 1. Micro-chip
