<Process Example>
Wafer surface films tend to dry fast and have a high water-repellency. DISCO has developed a product that suppresses particle adhesion for wafers with high water-repellency.
Photo 2 shows a wafer with aluminum film that has been processed using the developed product. Compared to Photo 1 (before product attachment), less particle adhesion is visible. (To make it easier to confirm particle removal results during processing, a wafer with aluminum film, which is susceptible to particle adhesion, was used.)
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Photo.1 Before product attachment | Photo.2 After product attachment |
The visible white spots on the wafer are particle adhesion.
DISCO offers optimum particle countermeasures according to the customer device and processing environment. If you are having trouble with particle adhesion, contact us at any time.
