<Process Example>
Increasing the die strength using the dry polish process was explained previously (released on November 18, 2002), however in addition to that, it is
also possible to reduce the warpage amount that occurs due to stress from the grinder process, and to remove the saw marks that occur during grinding.
By increasing the dry polish removal amount, the following effect can be secured.
| Photo 1.
Warpage condition after the grinding process |  | Photo 2.
Warpage condition after the dry polishing process |
| | |
This is the condition of a mirror wafer when ground to 50 um with common protective tape.
