Dry polishing is a special Disco-developed, constant-pressure stress relief process performed with a Disco Fully Automatic Polisher and a Disco dry polishing wheel.
Fully Automatic Polisher DFP8140 Dry polishing wheel
With a layout and method of operation A completely dry process, dry polishing
similar to Disco 8000 Series grinders, employs. A completely dry process,
Disco’s polishers offer superlative stability dry polishing employs no chemicals
and operability. or slurry whatsoever.
Constant-Pressure Processing
Constant-pressure processing allows for advanced process stability.
Disco recommends as standard for silicon wafers a removal amount of 2 µm.
