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<Process Example>
In dicing of silicon and glass bonded wafers by an electroplated blade, cracking can occur on the silicon surface during one-pass dicing due to blade wear and other causes. (See Photo 1.)
As a result, different types of blades have been used to perform step cut and other operations for silicon and glass.
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Photo 1: Silicon Surface of Existing One-pass Dicing (100x) |
At DISCO, we have developed a special electroplated blade to solve this issue.
This blade was formed by making pores in an existing electroplated blade to maintain the same cutting power and allow self sharpening. This enables one-pass dicing of silicon and glass bonded wafers, reducing the number of blade changes and realizing higher throughput.
Photos 2 and 3 show actual examples where one-pass dicing was applied to a silicon and+ glass wafer.
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Photo 2: Glass Surface (100x) | Photo 3: Silicon Surface (100x) |
This special electroplated blade can be used to enable continuous cutting without generating cracks on the silicon surface.
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