In addition to back-end processing (manufacturing steps that occur after devices have been created on the wafer) in the semiconductor industry, Disco’s precision grinders are also employed by wafer makers to create blank wafers at extremely precise flatness tolerances.
Goal of Processing
To grind blank wafers so that they exhibit an extremely precise degree of flatness.
Applicable Machines
DFG830, DFG871, and others.
Example of chart after grinding
Fig. 1: Computer image produced after grinding
As exemplified in the chart above, total thickness variation (TTV) of 0.5 µm or less is attainable when all process factors are precisely adjusted.
