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In the vast majority of cases, the Z1-spindle performs rough grinding, removing the bulk of material. Then the Z2-spindle performs fine grinding, removing most of the grinding damage left by the Z1-spindle and putting a finer finish on the wafer.
Machine: DFG841 | Machine: DFG841 |
Grinding wheel: 40/60-V | Grinding wheel: 4/6-B-K09 |
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Surface roughness after grinding
with 40/60-V | Surface roughness after grinding
with 4/6-B-K09 |
Z1-spindle facts
• Purpose is chiefly rough grinding
• Uses large-diameter diamond grit to remove large amount of material quickly
• Resulting finish is dull (compared to that produced by Z2)
• Resulting surface roughness is rough (compared to that produced by Z2)
• Resulting damage layer is deep (compared to post-Z2 layer)
Z2-spindle facts
• Purpose is chiefly fine grinding
• Uses a fine diamond grit to complete material removal and impart a fine finish
• Resulting finish is close to mirror quality
• Resulting surface roughness is fine (compared to that produced by Z1)
• Resulting damage layer is shallow (compared to post-Z1 layer)
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