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Applications Example

Wafer edge chipping countermeasure
The outer circumference of a typical silicon wafer is chamfered (refer to Photo 1). When a wafer is thinly ground, sometimes chipping can occur at the chamfered area due to the process load during grinding. In particular, when a wafer is ground below 50 um, this problem can easily occur.

<Process example>
If a chamfered wafer is ground, the wafer becomes susceptible to breakage due to edge becoming sharp (refer to Fig. 1).
In such a case, it is possible to prevent chipping of the wafer periphery during grinding by removing the wafer outer edge before grinding.
Photo 1.
Edge chipping countermeasure was not implemented on the outer edge of the wafer
Photo 2.
Edge chipping countermeasure was implemented on the outer edge of the wafer

<Edge chipping countermeasure not implemented>
Fig. 1.
Countermeasure was not implemented on the ground wafer
Photo 3.
Countermeasure was not implemented
- condition of the ground wafer edge

<Edge chipping countermeasure implemented>
Fig. 2.
Countermeasure was implemented on the ground wafer
Photo. 4
Countermeasure was implemented - condition of the ground wafer edge




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