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Applications Example

Processing wafers with DAF -2
Recently, adhesive material, called DAF (Die Attach Film), has become indispensable for stacking die in SiP (System in Package) used for mobile devices, and for stacking memory devices in flash memory. Typically, DAF is attached to the backside surface of a thinned wafer, and then singulated at the same time in the next process of wafer dicing. In doing so, problems, such as cross-sectional cracking, may occur.

<Processing example>

It is possible to curtail cross-sectional cracking by changing the blade, as shown below.
Blade before improvement
Blade after improvement
The processing quality of a DAF attached wafer is different depending on the DAF properties and silicon thickness. DISCO has experience in processing various DAF types. Therefore, if you are having difficulty with DAF processing, please contact your DISCO sales representative.


Reference Informations
The abbreviation of Die Attach Film is DAF. It is a special adhesive film used for mounting and stacking die.


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