To create today’s extremely small and thin packages, semiconductor die must be produced to exactingly thin specifications. But because thin die fracture more easily, it is also necessary to maximize overall die strength. To fulfill the need for stronger die, Disco developed dry polishing, an environmentally friendly process that uses no chemicals or slurry.
After dry polishing
Machine: DFP8140 Surface roughness
Wheel: Dry polishing wheel
Workpiece: Silicon
After Z2-spindle processing
Machine: DFG841 Surface roughness
Wheel: 4/6-B-K09
Workpiece: Silicon
Features of Dry Polishing Process
• Completely dry process: Removes grinding damage without use of chemicals or slurry
• Imparts a mirror-like finish to the surface processed
• No chemicals means lower running cost
“Saw marks”: The pattern left on the wafer by the grinding process.
