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<Process Example>
If a wafer with large warpage is processed using the standard process (Grinding => Dicing), it will be difficult to grind and handle the wafer, and process quality defects (see Photos 1 and 2) will tend to occur.
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Photo. 1
Defect example: Backside chipping | Photo 2
Defect example: Interface
crack between the resin and silicon |
Photos 1 and 2 shows chipping and cracking defects that tend occur during dicing due to the resin stress on the wafer.
The DBG process cuts a groove before grinding. As a result of this grooving process, it releases the resin stress and alleviates wafer warpage. Therefore, it is now possible to process wafer level-CSP without the difficulties and defects of the standard process.
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Figure 1 DBG Process Flow |
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Photo.3
DBG Process: Backside surface condition | Photo.4
DBG Process: Side surface condition |
The processability of the wafer level-CSP is different depending on the resin type and thickness, silicon thickness and wafer warpage condition. If you are experiencing wafer level-CSP processing difficulties, contact your local Disco sales representative. Disco can propose a processing method according to your device.
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