<Process Example>
Since there are protruding objects on the device side, by selecting a suitable tape for the bump height, die and final wafer thickness, it is possible to grind the wafer shown in Fig. 1.
Fig. 1 Bumped wafer
If an inappropriate tape has been selected, there is a risk of air bubbles forming and wafer breakage occurring due to stress concentrated in this area (Refer to Fig. 2).
Fig. 2 Grinding a bumped wafer
Disco is very experienced in grinding various bumped wafers. If you are having trouble with grinding bumped wafers, please contact your Disco sales representative.
