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As LEDs & RFID tags decrease in size and increase in performance, the demand for small size die continues to grow. Disco is making efforts to support the manufacturing of these parts by developing new technology. Disco offers Dicing Before Grinding (DBG) as a premier solution for small die production. The photographs below show very small die (400 µm square and 60 µm thick) produced from an 8" silicon wafer.
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Photo 1: Scanning electron microscope
image of front side | Photo 2: Scanning electron microscope image of backside |
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In the DBG process, first the wafer is grooved (half-cut with a dicing saw). Then the wafer is ground to a thin specification; die singulation occurs when the grinder grinds below the level of the grooves formed by the dicer. For this reason, compared to full cut dicing where the silicon and tape are cut at the same time, backside chipping and flying die are not an issue and the feed speed during grooving can be increased. This results in improved productivity.
An experimental blade just 10 µm in thickness grooved the wafers that yielded the die in the photographs above. A thinner blade means a narrower kerf, allowing for more die per wafer. For further information about how Disco and DBG can help you produce high-quality small die, please contact your Disco representative.
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