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DISCO HOME > Solutions > Applications Example > Grinding | |
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Applications Example |
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Wafer damaged TEM Photo | |
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| In recent years, there has been a need to increase the strength of thinned wafers (chips). The damaged layer as a result of the grinding process largely influences the strength of the wafer. Disco carries out research and development to reduce the damage of grinding and to remove the damage layer. |
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Photo 1 and 2 are TEM photographs of the wafer damage layer for a silicon wafer that has been ground with a #2000 grinding wheel and a poligrind wheel respectively. Grinding with a poligrind wheel results in a lower damage layer compared to a #2000 grinding wheel (reference: Chip Strength Measurement Result - http://www.disco.co.jp/eg/products/grinding_wheel/poligrind.html). For reference, a TEM photograph of dry polished wafer is shown in Photo 3.
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