LTCC, which has low heat conductivity, is a material where processing heat tends not to escape during dicing. The effect of this heat is more likely to deteriorate the blade tip shape during processing.
Therefore, when processing LTCC, it is important to select processing conditions and adjust the nozzle considering the "heat radiation of the processing point".
If processing continues with a deteriorated blade tip, it is highly possible that poor processing quality, cut position shift, or rise in processing load will occur.
Photos 1 & 2 show the blade tip conditions when the same blade specification is used to continuously process LTCC. The blade tip after nozzle adjustment has a better grain exposure condition.
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Photo 1 Before nozzle adjustment | Photo 2 After nozzle adjustment |
Reference: Blade tip condition and processing quality
Photos 3 & 4 compare the backside quality when processing a silicon wafer with good and bad blade conditions. If processing with a bad blade condition, the processing quality is bad.
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Photo 3
Bad blade condition & processing quality | Photo 4
Good blade condition & processing quality |
