In the past, it was difficult to grind certain workpieces on a conventional vacuum chuck table: warped, unusually shaped (square, ovoid, etc.), and pre-singulated devices. Using a dicing frame and a special chuck table is an effective way to fix such hard-to-vacuum workpieces during processing. Disco has created successful frame chuck applications for the following workpieces:
• Plastic-coated die (warpage an issue)
• Silicon wafers cut into quarters
• Silicon die
• ICs with mounted LT components
