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DISCO HOME > Solutions > Applications Example > Grinding | |
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Applications Example |
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Merits of TAIKO grinding | |
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| TAIKO grinding is a technology that thins only the inner part of the wafer and leaves an edge (approximately 2 mm wide) on the periphery of the wafer. Adopting this technologyreduces wafer warpage and the risk of wafer breakage during handling. |
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| <Processing example> Photos 2, 3 and 4 show 8-inch silicon wafers that have been ground to a thickness of 50 um. As the photographs show, the TAIKO ground wafer has substantially less warpage compared to the wafers that have been ground (full surface) with a #2000 grinding wheel or dry polishing wheel.
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