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In the in-feed grinding process, the grinding wheel and wafer rotate in the same direction while the grinding wheel descends upon the wafer at a set speed. With today’s demands for high integration and high process quality, in-feed grinding has become the overwhelmingly preferred method.
Infeed- Grinding | Creep-Feed Grinding |
| Machines: DFG82I/F8, DFG800, 8000 Series | Machines: DFG83H/6 |
| Wheels: IF Series | Wheels: RS Series |
Features of In-Feed Grinding
• Height gauge used to maintain constant thickness among wafers and to assess wheel wear.
• Resin bond grinding wheel are easily employed.
• Throughput varies according to the amount of material removed from wafer.
Features of Creep-Feed Grinding
• Direction of grind can be adjusted to match crystalline structure of wafer or die shape.
• Difficult to maintain constant thickness among wafers.
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