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DISCO HOME > Solutions > Applications Example > Dicing | |
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Applications Example |
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Profile processing using a dicer -2 | |
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| Usually a dicer is used to cut a workpiece into die. However, it is possible to also perform profile processing by using a specific blade shape. |
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| <Process example> The photograph below shows silicon grooved into 20 µm squares standing 250 µm high. Profile processing can be used for preparing micro components and sample preparation for testing.
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Reference Informations |
| Profile processing using a dicer http://is01.disco.co.jp/psc/aphp.nsf/0/1FA5FA41F5CCD29749257156004AFCC5 |