Product Information


Machine Name

Wafer Diameter
Grinding Method
Spindle	Type
	Number of axes
	Output (kW)
	Revolution speed (min-1 <rpm>)
	Z-axis vertical stroke (mm)
	Z-axis vertical grinding feed speed (mm/s)
	Z-axis vertical fast feed speed (mm/s)
	Min. Z-axis vertical movement (μm)
	Min. Z-axis vertical movement resolution (μm)
Height Gauge
	Measurement range (μm)
	Resolution (μm)
	Repeatability (μm)
Wafer Chuck Table
	Chuck table type
	Chuck method
	Number of revolutions (min-1 <rpm>)
	Number of chuck tables
	Chuck table cleaning
	Spark Out (chuck table revolutions setting)
Grinding Wheel
	Diamond wheel (mm)
Wafer Handling Section / Wafer Cleaning Section
	Cassette storage quantity
	Cassette flow
	Spinner unit
Vacuum Unit
	Discharge speed (m3/h)
	Achievable pressure (kPa•G)
	Electric motor (kW)
	Water flow rate (L/min)
Grinding Accuracy
	Thickness variation within one wafer (μm)
	Thickness variation between wafers (μm)
	Finish surface roughness (μm)
Utilities	Power supply (kVA)
	Power consumption
		During processing (kW)
		During warm-up (kW)
	Max. power(kVA)
	Air pressure (MPa•G)
	Air flow rate (L/min(ANR))
	Water pressure
		Grinding and cleaning (MPa•G)
		Cooling (MPa•G)
		Vacuum pump (MPa•G)
	Water flow rate
		Grinding and cleaning (L/min)
		Cooling (L/min)
		Vacuum pump (L/min)
	Exhaust duct capacity (m3/min)
	Machine dimensions( W x D x H ) (mm)
	Machine weight (kg)

*The above specifications may change due to technical modifications, Please confirm when placing your order.

Grinder Specs (Comparison)